2020–2021
Dual Credit Scholarship Application
Homeschool and Non-Certified Kentucky High School Students
The Dual Credit Scholarship provides assistance for Kentucky high school students in grades 11 or 12 who are enrolled in
dual credit classes at a participating Kentucky college or university. Homeschool and non-certified Kentucky high school
students who are Kentucky residents can apply for the Dual Credit Scholarship by providing the information requested
below and mailing a printed copy of the application to:
KHEAA
Attn: Dual Credit Scholarship
P.O. Box 798
Frankfort, KY 40602-0798
The deadline for requesting fall semester scholarships is October 1, 2020. The deadline for spring semester requests is
March 1, 2021.
Subject to available funding, scholarships will be awarded to eligible students on a first-come, first-served basis, with 12th-
graders receiving top priority. KHEAA will send notification of approval or denial to all applicants.
PRINT LEGIBLY AND DO NOT ABBREVIATE
Last Name:
First Name:
Middle Initial:
Date of Birth (CCYY/MM/DD):
City: County of Residence:
State: Zip Code: Phone: ( )
Email Address:
Are you a homeschool student? If no, provide the name of your high school:
What is your academic grade level for the 2020-2021 year?
What is your expected high school graduation date? (Year/Month)
Scholarship awards are limited to two (2) classes per student. Please indicate when and where you are taking dual
credit classes for 2020–2021 scholarship consideration. Write out the full name of the college.
Scholarship #1 Scholarship #2
Semester (circle): Fall or Spring Semester (circle): Fall or Spring
College Name: College Name:
By signing this application, I certify all information reported to be true and accurate to the best of my knowledge. I agree
that if I am awarded a scholarship, I will complete the required counseling as directed by KHEAA and the dual credit
classes for which funds are provided. I understand the scholarship only covers tuition cost and that I am responsible for
purchasing textbooks and other materials.
Applicant Signature: Date:
