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Formf I (Bay Area Air Quality Management District)

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BAY AREA AIR QUALITY MANAGEMENT DISTRICT
DATA FORM F
Semiconductor Fabrication Area
375 Beale Street, Suite 600, San Francisco, CA 94105.
(415) 749-4990
New Modified Retro
(for office use only)
Form F is for the following equipment used in the manufacture of semiconductors or related solid state
devices: Solvent Stations, Wet Chemical Stations, Siliconizing Reactors, Chemical Vapor Deposition,
Diffusion Furnaces and Photoresist Lines. One Form F should be completed for all such equipment in each
Fabrication Area. SEE PAGE 2 FOR INSTRUCTIONS.
1. Company Name
Plant No:
If Unknown, leave blank)
2. Name or Description of Fabrication Area
3. Effective Date
Source No.
S-
4. Equipment Type (Check one or more and complete corresponding parts below):
Solvent Stations (Part A) Diffusion Furnaces (Part E)
Wet Chemical Stations (Part B) Photoresist Lines (Part F)
Siliconizing Reactors (Part C) Exempt Sources (Part G)
Chemical Vapor Deposition (Part D)
5. Typical Use
hours/day
days/week
weeks/year
6. Typical % of total
annual usage:
Dec-Feb
%
Mar-May
%
Jun-Aug
%
Sep-Nov
%
Part A - Solvent Stations
7. Aggregate Holding Capacity
gal
Number of solvent station hoods
8. Do all solvent containing reservoirs, sinks, and containers have covers?
With regard to air pollutant flow, what abatement devices and/or emission points are immediately downstream?
9. Abatement Devices
A
A
A
Emission Points
P
P
P
Part B - Wet Chemical Stations
10. Aggregate Holding Capacity
gal
Number of Wet Station Hoods
With regard to air pollutant flow, what abatement devices and/or emission points are immediately downstream?
11. Abatement Devices
A
A
A
Emission Points
P
P
P
Part C - Siliconizing Reactors
12. Number of Reactors
With regard to air pollutant flow, what abatement devices and/or emission points are immediately downstream
13. Abatement Devices
A
A
A
Emission Points
P
P
P
Part D - Chemical Vapor Deposition (excluding vacuum and low pressure CVD)
14. Number of Chambers
With regard to air pollutant flow, what abatement devices and/or emission points are immediately downstream
15. Abatement Devices
A
A
A
Emission Points
P
P
P
Part E - Diffusion, Oxidizing, Alloying and/or Annealing Furnaces
16. Number of Chambers
With regard to air pollutant flow, what abatement devices and/or emission points are immediately downstream
17. Abatement Devices
A
A
A
Emission Points
P
P
P
(revised 4/12/16)
Data Form F (Page 2)
Part F - Photoresist
18. Number of Negative: Applicators
Developers
With regard to air pollutant flow, what abatement devices and/or emission points are immediately downstream?
19. Abatement Devices
A
A
A
Emission Points
P
P
P
20. Number of Positive: Applicators
Developers
With regard to air pollutant flow, what abatement devices and/or emission points are immediately downstream?
21. Abatement Devices
A
A
A
Emission Points
P
P
P
Part G - Exempt Equipment - Indicate quantities for the following operations
22. Ion implantation chambers
23 Vacuum deposition chambers
24 Sputtering chambers
25. Lapping and polishing machines
26. Plasma etching or ashing chambers
Person completing this form:
Date:
Complete and attach Chemical Usage Summary, Page 3 below
INSTRUCTIONS FOR COMPLETING FORM F
Complete Data Form P for each Fabrication Area
Complete and attach Data Form U for each Fabrication Area
See BAAQMD Regulation 3 for equipment definitions
Number
Instructions
2
Name and/or describe the fabrication area. The effective date is either the date each fabrication area will
commence operations, if new, or the date of the most recently installed piece of equipment, if currently operating.
4
Check as many parts as are applicable to each fabrication and complete each part.
7,10
Aggregate holding capacity is the total quantity (#7) solvent or (#10) other chemicals normally being held in all
sinks. Number of hoods is the total number of ventilating hoods that exhaust the stations.
14
Exclude vacuum and low pressure CVD.
18,20
Note: In multitrack equipment, each separate track counts as one applicator or developer. In integrated
equipment, where the applicator and developer are combined in one machine, count each applicator and each
developer.
Data Form F (page 3)
Plant No.____
Source No.________
Usage Information
Note usage of each material. Annual throughput, for each material, = usage in pure form + usage
as constituent of other mixture.
Material
Code
Annual Usage
1000 gal/yr
Acetone
455
Butyl Acetate
48
Chlorofluorocarbons (e.g. freon)
211
Ethyl Acetate
104
Ethylene Glycol
131
Hexamethyldisilazane (HMDS)
508
Isopropyl Alcohol (IPA)
157
Methanol
179
Methyl Ethyl Ketone (MEK)
169
Methylene Chloride
396
Photoresist Maskant (negative)
Complete Photoresist
Photoresist Developer (negative)
Operations table. See
Photoresist Maskant (positive)
following page.
Photoresist Developer (positive)
Trichloroethane (TCA)
294
Trichloroethylene (TCE)
295
Toluene
293
Xylene (Xylol)
307
Other Organics (precursor)
Other Organics (nonprecursor)
Acetic Acid
454
Ammonium Hydroxide
471
Anhydrous Ammonia
22
Aqueous Ammonia
22
Aqua Regia
507
Hydrochloric Acid (liq)
149
Hydrofluoric Acid (HF)
150
Nitric Acid
191
Phenol
214
Sulfuric Acid
146
Stripper (specify trade name)
Others
Annual Usage
liters/yr
(excluding carrier gas)
Arsine
483
Boron Nitride
483
Boron Tribromide
483
Boron Trichloride
483
Other Boron-containing gases
483
Phosphine
483
Silane
483
Other Dopant gases (specify)
483
Data Form F (page 4)
Photoresist Operations
Instructions
Check appropriate box for negative or positive photoresist lines. If both negative and positive photoresist operations exist in the same fabrication
area, photocopy this page and complete one for positive PR operations.
Check one: negative positive
Photoresist Maskant
Maskant #1
Maskant #2
Maskant #3
1. Maskant trade name
2. Total maskant applied annually
3. Percent organic solvent, by volume
4. Composition of organic solvent
a) largest component - % of total
- material code
b) 2nd largest component - % of total
- material code
Photoresist Developer
Developer #1
Developer #2
Developer #3
1. Developer trade name
2. Total developer applied annually
3. Percent organic solvent, by volume
4. Composition of organic solvent
a) largest component - % of total
- material code
b) 2nd largest component - % of total
- material code
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Completed 19 July 2020

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