Data Form F is for semiconductor manufacturing operations that are subject to Regulation 8, Rule 30. Additional forms and all
District regulations and rules are available on the District’s web site. Submit one data form for each semiconductor fabrication
area. Contact your assigned plant engineer or the Engineering Division at the above telephone number if you need assistance
completing this form.
Plant No.
Business Name
Source No.
Source Description
Initial Date of Operation (leave blank if this application is submitted to modify an existing permitted source)
/ /
Complete all applicable parts on this six-page form. Maximum annual throughput is the amount of material that will appear as a
permit condition limit. The usage limit should be set high enough so that it is not likely to be exceeded while taking into
consideration District BACT, offset, and toxics requirements. Please propose an annual usage limit at this time and
provide Material Safety Data Sheets for solvent mixtures and photoresist and other wafer coating materials. *Please
leave Material Codes blank, if unknown.
Part A Solvent Cleaning Operations
1. Solvent Sinks (as defined in Regulation 8-30-214)
Solvent Name or
Trade Name of Solvent Mixtures
(attach MSDS for Solvent Mixtures)
Material
Code*
Organic
Content
(wt %)
Density
(lb/gal)
P-#, or
If Abated,
A-#
ONE COMPONENT SOLVENTS
100%
100%
100%
100%
100%
100%
100%
100%
100%
100%
100%
100%
SOLVENT MIXTURES (MORE THAN ONE
COMPONENT SOLVENTS)
Attach
MSDS
Attach
MSDS
Attach
MSDS
FormF (revised 4/12/16)
BAY AREA AIR QUALITY MANAGEMENT DISTRICT
Data Form F Worksheet
Engineering Division
Semiconductor Manufacturing Operations
375 Beale Street, Suite 600, San Francisco, CA 94105
(Page 1 of 6)
(415) 749-4990 . . . Fax (415) 749-5030 . . . www.baaqmd.gov
Data Form F Worksheet
Semiconductor Manufacturing Operations
(Page 2 of 6)
2. Solvent Spray Stations (as defined in Regulation 8-30-221)
Solvent Name or
Trade Name of Solvent Mixtures
(attach MSDS for Solvent Mixtures)
Material
Code*
Organic
Content
(wt %)
Density
(lb/gal)
P-#, or
If Abated,
A-#
ONE COMPONENT SOLVENTS
100%
100%
100%
100%
100%
100%
100%
100%
SOLVENT MIXTURES (MORE THAN ONE
COMPONENT SOLVENTS)
Attach
MSDS
Attach
MSDS
Attach
MSDS
3. Solvent Vapor Stations (as defined in Regulation 8-30-222)
Solvent Name or
Trade Name of Solvent Mixtures
(attach MSDS for Solvent Mixtures)
Material
Code*
Organic
Content
(wt %)
Density
(lb/gal)
P-#, or
If Abated,
A-#
ONE COMPONENT SOLVENTS
100%
100%
100%
100%
100%
100%
100%
SOLVENT MIXTURES (MORE THAN ONE
COMPONENT SOLVENTS)
Attach
MSDS
Attach
MSDS
Attach
MSDS
*Please leave Material Codes blank, if unknown.
Data Form F Worksheet
Semiconductor Manufacturing Operations
(Page 3 of 6)
4. Wipe Cleaning Operations (as defined in Regulation 8-30-225)
Solvent Name or
Trade Name of Solvent Mixtures
(attach MSDS for Solvent Mixtures)
Material
Code*
Organic
Content
(wt %)
Density
(lb/gal)
P-#, or
If Abated,
A-#
ONE COMPONENT SOLVENTS
100%
100%
100%
100%
100%
SOLVENT MIXTURES (MORE THAN ONE
COMPONENT SOLVENTS)
Attach
MSDS
Attach
MSDS
Attach
MSDS
Part B Coating Operations
1. Photoresist (as defined in Regulation 8-30-215) and Other Wafer Coating
Photoresist/Other Wafer Coating
Trade Name
(attach MSDS)
Organic
Content
(wt %)
Density
(lb/gal)
P-#, or
If Abated,
A-#
2. Solvent-Based Developer (as defined in Regulation 8-30-219)
Solvent-Based Developer
Trade Name
(attach MSDS)
Organic
Content
(wt %)
Density
(lb/gal)
P-#, or
If Abated,
A-#
*Please leave Material Codes blank, if unknown.
Data Form F Worksheet
Semiconductor Manufacturing Operations
(Page 4 of 6)
3. Other Miscellaneous Solvent Usage
Solvent Name or
Trade Name of Solvent Mixtures
(attach MSDS for Solvent Mixtures)
Material
Code*
Organic
Content
(wt %)
Density
(lb/gal)
P-#, or
If Abated,
A-#
ONE COMPONENT SOLVENTS
100%
100%
100%
100%
SOLVENT MIXTURES (MORE THAN ONE
COMPONENT SOLVENTS)
Attach
MSDS
Attach
MSDS
Attach
MSDS
Part C Other Operations Involving Materials That Are Toxic (listed in Table 2-5-1 of Regulation 2-5)
1. Inorganic Liquids
Inorganic Liquid Name
Material
Code*
Density
(lb/gal)
Maximum Annual
Throughput
(gal/yr)
P-#, or
If Abated,
A-#
*Please leave Material Codes blank, if unknown.
2. Organic and/or Inorganic Gases (excluding carrier gases)
Organic and/or Inorganic Gas Name
Material
Code*
Maximum Annual Throughput
(lb/yr)
P-#, or
If Abated,
A-#
*Please leave Material Codes blank, if unknown.
Data Form F Worksheet
(Page 5 of 6)
COMPLIANCE DETERMINATION WORKSHEET (Completion required for all operations that exist in fab area source)
Photoresist Operations Using Solvent-Based Developer Requirements
Yes
No
Is solvent-based developer applied by any method other than by immersion in a solvent sink? If no, go to
next section.
Yes
No
Are all exhaust gases containing VOC from both the solvent-based photoresist application and solvent-
based developer operations in the fab area vented to an approved emission control device which captures
and abates at least 90% (by weight) of VOC evaporated at the application and development operations?
(8-30-302)
Yes
No
Is total combined net consumption of solvent-based photoresist and solvent-based developer less than 24
gallons per month? (8-30-402)
Solvent Sink Requirements
Yes
No
Do all solvent sinks containing VOC have a cover? (8-30-304.1)
Yes
No
If no (all solvent sinks do not have a cover), are all uncovered solvent sinks containing VOC abated by an
approved emission control device? (8-30-304.2; 8-30-304.5)
Yes
No
Is the capacity of all solvent sinks clearly labeled on the sink (8-30-304.2)
Yes
No
Are all materials containing VOC, including waste solvents, stored or disposed in a manner so as not to
allow evaporation into the atmosphere? (8-30-304.3)
Yes
No
Are liquid solvent leaks repaired immediately or the equipment shut down (8-30-304.4)
Yes
No
Are there any unheated solvent sinks with a vapor pressure higher than 30 mmHg at 20 degrees C, OR
any heated sinks with a freeboard ratio
1
less than 0.75? (8-30-304.5)
Yes
No
If yes, are there any such sinks with capacity greater than 1 liter? (8-30-304.5.1)
Yes
No
If yes (greater than 1 liter), are all such sinks abated by an approved emission control device.(8-30-304.2;
8-30-304.5.2)
1.
The vertical distance from the top of the evaporative area to the bottom of the lowest opening in the solvent cleaner
(freeboard height) divided by the smaller of the length or width of the solvent cleaner evaporative area.
Solvent Spray Station Requirements
Yes
No
Does the station(s) operate as a sealed enclosure unless sampling, maintenance, loading or unloading
procedures require operator access. (8-30-305.1)
Yes
No
If no (station is not a sealed enclosure), is station abated by an approved emission control device which
captures and abates at least 90% (by weight) of VOC emitted from station? (8-30-305.1)
Yes
No
Are liquid solvent leaks repaired immediately or the equipment shut down (8-30-305.2)
Yes
No
Does station have VOC emissions that exceed 250 lb/month per station, as calculated in accordance with
8-30-504?
Yes
No
If yes (station’s VOC emissions exceeds 250 lb/month), does an approved emission control device abate
station? (8-30-305.3)
Solvent Vapor Station Requirements
Yes
No
Does the station(s) operate as a sealed enclosure unless sampling, maintenance, loading or unloading
procedures require operator access. (8-30-306.1)
Yes
No
If no (station is not a sealed enclosure), is station abated by an approved emission control device which
captures and abates at least 90% (by weight) of VOC emitted from station? (8-30-306.1)
Yes
No
Are liquid solvent leaks repaired immediately or the equipment shut down (8-30-306.2)
Yes
No
Does station have VOC emissions that exceed 250 lb/month per station, as calculated in accordance with
8-30-504?
Yes
No
If yes (station’s VOC emissions exceeds 250 lb/month), does an approved emission control device abate
station? (8-30-306.3)
Data Form F Worksheet
Semiconductor Manufacturing Operations
(Page 6 of 6)
Fab Area Wipe Cleaning Requirements
Yes
No
Is a solution containing less than or equal to 10% VOC by weight only used to perform wipe cleaning of fab
area walls, floors and other fab area surfaces, including fabrication tool enclosures? (8-30-307)
Yes
No
Discarded rags and paper that have been used for cleaning are kept in a closed container. (8-1-320)
Yes
No
All solvent containers are closed at all times except when a solvent is being dispensed. (8-1-321)
Additional Comments, If Any
CERTIFICATION (I hereby certify that all information contained herein is true and correct)
Signature
Title
Date