Version: 3/20/2019 2
Additional Course Information
Topical Outline: Each offering of this course must include the following topics (be sure to include information regarding lab,
practicum, and clinical or other non-lecture instruction).
Educational Objectives of CETT1321:
The following performance will be expected of any student completing this course with a passing grade.
There is no absolute time limit on the performance of these objectives, unless noted, but the grade received by the
student may depend, in part, on the relative speed and precision of the student’s performance in
these tasks.
• Describe some of the factors that are taken into account when one designs electronic equipment.
• Identify components on preliminary sketches and formal drawings of electronic equipment.
• Describe and/or demonstrate safe and proper care and usage of hand tools, power tools, and measuring
instruments which are commonly encountered in constructing electronic devices.
• Demonstrate the safe and proper care and usage of chemicals frequently used in electronic device cleaning and
construction.
• Demonstrate several of the methods (soldering, crimping, and mechanical) of making electrical connections.
• Demonstrate the fabrication of various types of cables and connectors.
• Produce acceptable solder connections on assigned projects.
• De-solder components from circuit boards without causing any damage.
• Exposure to layout, and fabrication of printed circuit boards.
• Exposure to fabrication and repair techniques of electrical connectors and components.
• Identify electronic components from their schematic symbols.
• Demonstrate ability to correctly mount several types of SMT (Surface Mount Technology) components
• Complete individual projects as assigned by the instructor.
Course Learning Outcomes:
Learning Outcomes – Upon successful completion of this course, students will:
1. Apply electronic circuit fabrication techniques to industry standards
2. Document step-by-step procedures
3. Create schematic/wiring diagrams
4. Apply circuit description
5. Identify the tools required to produce a printed circuit board
6. Produce soldering connections.
Methods of Assessment:
Outcomes 1-6 will be assessed by:
•Exams – written, solder projects
•Homework
•Labs
•Quizzes
•Reassessed in Capstone Experience: CETT 2349 Final Project course
Required text(s), optional text(s) and/or materials to be supplied by the student:
No Textbook Required
